Dyna-Purge Purging Compound – D2

Select by process requirements

A purging compound for cleaning polymer processing equipment.

Primary applications

• Select the grade according to polymer and operating temperature
• Evaluate under actual machine conditions
• GKFRP can support purge-process review

Equipment and processes

The Product Information Sheet lists injection molding with cold and hot runners, plus extrusion applications including profile, sheet, cast film, compounding and blow molding. D2 is listed for all resin types within its operating temperature window.

Key operating data

* Actual quantity depends on machine condition and contamination level.

Features and benefits

• Low-odor formulation.
• Heat stable and recommended for shutdown and start-up.
• No premixing required; the manufacturer states no processing adjustments are required for use.
• Less sticky for easier clean-up after purging.
• Designed to be effective with a relatively small quantity, supporting a low cost-per-purge.
• The Product Information Sheet states unlimited shelf life.
• The manufacturer describes the ingredients as non-hazardous, non-chemical and FDA compliant; suitability for a specific line or regulatory requirement should still be confirmed against current technical and compliance documentation.