Product overview
Select by process requirements
A purging compound for cleaning polymer processing equipment.
The non-abrasive, non-chemical integrated polymer system is designed to loosen carbonized and degraded resin so it can be flushed from the machine during the purge cycle.
Applications
- Select the grade according to polymer and operating temperature
- Evaluate under actual machine conditions
- GKFRP can support purge-process review
Key specifications from the Product Information Sheet
Temperature range575–715°F (302–379°C)
Resin typesHigh-temperature engineering resins
Minimum clearanceNone
Typical purge amount1–2× barrel capacity
Features and benefits
- Designed for high-temperature engineering resins including PEEK, PEI, PPS, PPA and PSU.
- Effective across a broad 302–379°C temperature range.
- Non-abrasive, non-chemical integrated polymer system.
- Helps loosen and remove carbonized and degraded resin.
- Heat stable and recommended for shutdown and start-up.
- No mixing or soaking required before use.
- Manufacturer states the ingredients are safe, non-hazardous and FDA compliant.
- Unlimited shelf life according to the product sheet.
Technical note
Specifications, dosage, operating conditions and safety requirements must be checked against the manufacturer’s current TDS/SDS before implementation.
Where E2 fits in the Dyna-Purge range
Positioning
E2 is focused on high-temperature engineering resins and a 302–379°C operating window.
Typical use
Useful when changing over or cleaning systems processing PEEK, PEI, PPS, PPA, PSU and similar high-temperature resins.
Technical support
GKFRP can help review purge grade selection based on polymer, operating temperature, machine type and cleaning objective.